Technical Documents
Specifications
Brand
MicrochipProduct Type
Microcontroller
Series
PIC16F15276
Package Type
PDIP
Mount Type
Through Hole
Pin Count
40
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
28kB
Maximum Clock Frequency
32MHz
RAM Size
2kB
Maximum Supply Voltage
5.5V
Maximum Power Dissipation Pd
800mW
Number of Programmable I/Os
36
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Length
2mm
Standards/Approvals
No
Minimum Supply Voltage
1.8V
Number of Timers
1
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
28 x 10 Bit
Program Memory Type
FLASH
Product Details
The Microchip PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for extreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA).
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Each (In a Tube of 10) (Exc. VAT)
10
Price on asking
Each (In a Tube of 10) (Exc. VAT)
Stock information temporarily unavailable.
10
Ideate. Create. Collaborate
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Technical Documents
Specifications
Brand
MicrochipProduct Type
Microcontroller
Series
PIC16F15276
Package Type
PDIP
Mount Type
Through Hole
Pin Count
40
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
28kB
Maximum Clock Frequency
32MHz
RAM Size
2kB
Maximum Supply Voltage
5.5V
Maximum Power Dissipation Pd
800mW
Number of Programmable I/Os
36
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Length
2mm
Standards/Approvals
No
Minimum Supply Voltage
1.8V
Number of Timers
1
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
28 x 10 Bit
Program Memory Type
FLASH
Product Details
The Microchip PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for extreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA).
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
