Technical Documents
Specifications
Brand
RS ProProduct Type
Potting Compound
Trade Name
RS PRO
Package Type
Pack
Product Form
Viscous Liquid
Package Size
100 g
Cure Time
24 h
Thermal Conductivity
0.45W/mK
Colour
Black
Minimum Operating Temperature
-40°C
Mixing Ratio
11:1
Maximum Operating Temperature
120°C
Standards/Approvals
No
Specific Gravity
1.83
Base Chemical
Epoxy
Country of Origin
United Kingdom
Product Details
From RS PRO a high quality good all round easy to apply two-part flame retardant black epoxy resin potting compound designed for general purpose electronics use. This epoxy potting compound provides a hard coating around your electrical components and offers excellent all-round protection including resistance to chemicals and water. Using a clean' type of flame retardant technology this epoxy compound, when heated, produces low toxicity fumes and low smoke emission. The components that go to make up this black epoxy resin potting compound are supplied in convenient two-component packs, one containing the epoxy resin and the other containing the hardener. The contents are mixed together without opening the bag, simply remove the central clip and mix!
This epoxy resin is a type of electronic potting compound used for encasing or encapsulating PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which protects and insulates them from harsh environments. These harsh environments include moisture, chemicals, vibration, thermal or physical shock and general contamination. The mechanical protection provided by this epoxy compound enables the components to maintain high performance under extreme conditions.
This black epoxy resin is designed to provide protection to electrical components in a general use environment in standard atmospheric conditions. The applications for this cost-effective and versatile compound are diverse and can include PCBs and electronic components in military, industrial, automotive and domestic devices.
This black epoxy potting compound is supplied in twin pack format. One pack contains the epoxy resin and one contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the epoxy to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.
Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called The pot. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called potted PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.
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€ 4.60
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€ 4.60
€ 4.60 Each (Exc. VAT)
Stock information temporarily unavailable.
1
Technical Documents
Specifications
Brand
RS ProProduct Type
Potting Compound
Trade Name
RS PRO
Package Type
Pack
Product Form
Viscous Liquid
Package Size
100 g
Cure Time
24 h
Thermal Conductivity
0.45W/mK
Colour
Black
Minimum Operating Temperature
-40°C
Mixing Ratio
11:1
Maximum Operating Temperature
120°C
Standards/Approvals
No
Specific Gravity
1.83
Base Chemical
Epoxy
Country of Origin
United Kingdom
Product Details
From RS PRO a high quality good all round easy to apply two-part flame retardant black epoxy resin potting compound designed for general purpose electronics use. This epoxy potting compound provides a hard coating around your electrical components and offers excellent all-round protection including resistance to chemicals and water. Using a clean' type of flame retardant technology this epoxy compound, when heated, produces low toxicity fumes and low smoke emission. The components that go to make up this black epoxy resin potting compound are supplied in convenient two-component packs, one containing the epoxy resin and the other containing the hardener. The contents are mixed together without opening the bag, simply remove the central clip and mix!
This epoxy resin is a type of electronic potting compound used for encasing or encapsulating PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which protects and insulates them from harsh environments. These harsh environments include moisture, chemicals, vibration, thermal or physical shock and general contamination. The mechanical protection provided by this epoxy compound enables the components to maintain high performance under extreme conditions.
This black epoxy resin is designed to provide protection to electrical components in a general use environment in standard atmospheric conditions. The applications for this cost-effective and versatile compound are diverse and can include PCBs and electronic components in military, industrial, automotive and domestic devices.
This black epoxy potting compound is supplied in twin pack format. One pack contains the epoxy resin and one contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the epoxy to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.
Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called The pot. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called potted PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.
