Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5.0
Number of Contacts
4
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Country of Origin
China
Product Details
Use this robust and reliable wire-to-board Molex PCB (printed circuit board) header to establish multiple power connections to your board. The compact and space-saving design carries up to 5A of current per pin for an ideal low to mid-range power distribution solution. A locking ramp provides secure latching to ensure connectors and connections don't come loose and disrupt power transmission. The tin-plated brass contacts provide reliable conductivity as well as resistance to corrosion, so you can be certain of the unit's long-lasting performance.
A connector houses various terminals that plug into the header on your PCB. You typically solder your header onto your board, whereas you can connect and unplug your connector as needed.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Stock information temporarily unavailable.
€ 147.79
€ 1.478 Each (Supplied in a Box) (Exc. VAT)
Production pack (Box)
100
€ 147.79
€ 1.478 Each (Supplied in a Box) (Exc. VAT)
Stock information temporarily unavailable.
Production pack (Box)
100
| Quantity | Unit price | Per Box |
|---|---|---|
| 100 - 370 | € 1.478 | € 7.39 |
| 375 - 1495 | € 1.42 | € 7.10 |
| 1500 - 2995 | € 1.329 | € 6.65 |
| 3000+ | € 1.281 | € 6.41 |
Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5.0
Number of Contacts
4
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Country of Origin
China
Product Details
Use this robust and reliable wire-to-board Molex PCB (printed circuit board) header to establish multiple power connections to your board. The compact and space-saving design carries up to 5A of current per pin for an ideal low to mid-range power distribution solution. A locking ramp provides secure latching to ensure connectors and connections don't come loose and disrupt power transmission. The tin-plated brass contacts provide reliable conductivity as well as resistance to corrosion, so you can be certain of the unit's long-lasting performance.
A connector houses various terminals that plug into the header on your PCB. You typically solder your header onto your board, whereas you can connect and unplug your connector as needed.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals