Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5.0
Housing Material
Thermoplastic
Number of Contacts
2
Number of Rows
1
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Plating
Tin
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Female
Maximum Operating Temperature
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Product Details
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Stock information temporarily unavailable.
€ 88.41
€ 0.884 Each (Supplied in a Bag) (Exc. VAT)
Production pack (Bag)
100
€ 88.41
€ 0.884 Each (Supplied in a Bag) (Exc. VAT)
Stock information temporarily unavailable.
Production pack (Bag)
100
| Quantity | Unit price | Per Bag |
|---|---|---|
| 100 - 370 | € 0.884 | € 4.42 |
| 375 - 1495 | € 0.847 | € 4.23 |
| 1500 - 2995 | € 0.793 | € 3.96 |
| 3000+ | € 0.76 | € 3.80 |
Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5.0
Housing Material
Thermoplastic
Number of Contacts
2
Number of Rows
1
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Plating
Tin
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Female
Maximum Operating Temperature
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Product Details
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals