HARWIN 5.5 mm Grounding Contact

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.

Features and Benefits

Ideal for use on surface mount PCBs
Excellent spring properties
Designed for automated application using standard placement equipment
Suitable for wiping and sliding applications
Multidirection versions for PCB edge connections
Available in a wide range working heights

Applications

The compact size of these EZ-BoardWare grounding spring contacts makes them ideal for use in areas where there is limited access and in Blindmate applications. Typical applications include POS tracking, home entertainment and instrument panels, Industrial process control equipment, Mobile power units, Motion control units