Technical Documents
Specifications
Brand
InfineonMemory Size
64MB
Product Type
Flash Memory
Interface Type
CFI
Package Type
BGA
Pin Count
48
Organisation
8M x 8 Bit
Mount Type
Surface
Cell Type
NOR
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.6V
Timing Type
Asynchronous
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
840μm
Length
8.15mm
Standards/Approvals
No
Width
6.15mm
Number of Bits per Word
8
Supply Current
50mA
Maximum Random Access Time
70ns
Series
S29GL064S
Automotive Standard
AEC-Q100
Number of Words
8K
Product Details
The S29GL-S mid density family of devices are 3.0-volt single-power flash memory manufactured using 65 nm MirrorBit technology.
The S29GL064S is a 64-Mb device organized as 4,194,304 words or 8,388,608 bytes. Depending on the model number, the devices have 16bit wide data bus only, or a 16bit wide data bus that can also function as an 8bit wide data bus by using the BYTE# input.
The devices can be programmed either in the host system or in standard EPROM programmers. Access times as fast as 70 ns are available. Package offerings include 48pin TSOP, 56pin TSOP, 48-ball fine-pitch BGA, and 64-ball Fortified BGA, depending on model number. Each device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. Each device requires only a single 3.0-volt power supply for both read and write functions. In addition to a VCC input, a high-voltage accelerated program (ACC) feature is supported through increased voltage on the WP#/ACC or ACC input. This feature is intended to facilitate system production. Commands are written to the device using standard microprocessor write timing. Write cycles also internally latch addresses and data needed for the programming and erase operations.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.
The Advanced Sector Protection features several levels of sector protection, which can disable both the program and erase operations in certain sectors.
Stock information temporarily unavailable.
€ 1,213.94
€ 3.592 Each (In a Tray of 338) (Exc. VAT)
338
€ 1,213.94
€ 3.592 Each (In a Tray of 338) (Exc. VAT)
Stock information temporarily unavailable.
338
Technical Documents
Specifications
Brand
InfineonMemory Size
64MB
Product Type
Flash Memory
Interface Type
CFI
Package Type
BGA
Pin Count
48
Organisation
8M x 8 Bit
Mount Type
Surface
Cell Type
NOR
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.6V
Timing Type
Asynchronous
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
840μm
Length
8.15mm
Standards/Approvals
No
Width
6.15mm
Number of Bits per Word
8
Supply Current
50mA
Maximum Random Access Time
70ns
Series
S29GL064S
Automotive Standard
AEC-Q100
Number of Words
8K
Product Details
The S29GL-S mid density family of devices are 3.0-volt single-power flash memory manufactured using 65 nm MirrorBit technology.
The S29GL064S is a 64-Mb device organized as 4,194,304 words or 8,388,608 bytes. Depending on the model number, the devices have 16bit wide data bus only, or a 16bit wide data bus that can also function as an 8bit wide data bus by using the BYTE# input.
The devices can be programmed either in the host system or in standard EPROM programmers. Access times as fast as 70 ns are available. Package offerings include 48pin TSOP, 56pin TSOP, 48-ball fine-pitch BGA, and 64-ball Fortified BGA, depending on model number. Each device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. Each device requires only a single 3.0-volt power supply for both read and write functions. In addition to a VCC input, a high-voltage accelerated program (ACC) feature is supported through increased voltage on the WP#/ACC or ACC input. This feature is intended to facilitate system production. Commands are written to the device using standard microprocessor write timing. Write cycles also internally latch addresses and data needed for the programming and erase operations.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.
The Advanced Sector Protection features several levels of sector protection, which can disable both the program and erase operations in certain sectors.