Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Country of Origin
China
Product Details
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Stock information temporarily unavailable.
€ 9.42
€ 0.377 Each (In a Pack of 25) (Exc. VAT)
Standard
25
€ 9.42
€ 0.377 Each (In a Pack of 25) (Exc. VAT)
Stock information temporarily unavailable.
Standard
25
| Quantity | Unit price | Per Pack |
|---|---|---|
| 25 - 75 | € 0.377 | € 9.42 |
| 100 - 225 | € 0.366 | € 9.16 |
| 250 - 475 | € 0.352 | € 8.81 |
| 500 - 975 | € 0.341 | € 8.52 |
| 1000+ | € 0.328 | € 8.19 |
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Country of Origin
China
Product Details
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
