RS PRO Heatsink, Universal Square Alu, 0.39°C/W, 150 x 150 x 25mm, PCB Mount

RS Stock No.: 903-3153Brand: RS PRODistrelec Article No.: 30405112
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Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Square Alu

Length

150mm

Width

150mm

Height

25mm

Dimensions

150 x 150 x 25mm

Thermal Resistance

0.39°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 113AB Series, 150mm Wide x 25mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

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€ 33.94

Each (Exc. VAT)

RS PRO Heatsink, Universal Square Alu, 0.39°C/W, 150 x 150 x 25mm, PCB Mount

€ 33.94

Each (Exc. VAT)

RS PRO Heatsink, Universal Square Alu, 0.39°C/W, 150 x 150 x 25mm, PCB Mount
Stock information temporarily unavailable.

Buy in bulk

QuantityUnit price
1 - 9€ 33.94
10 - 24€ 31.21
25 - 49€ 29.86
50 - 99€ 28.84
100+€ 26.49

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Square Alu

Length

150mm

Width

150mm

Height

25mm

Dimensions

150 x 150 x 25mm

Thermal Resistance

0.39°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 113AB Series, 150mm Wide x 25mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.