Winbond SLC NAND 1Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25N01GVTCIG

RS Stock No.: 188-2739Brand: WinbondManufacturers Part No.: W25N01GVTCIG
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Technical Document

Specifications

Brand

Winbond

Memory Size

1Gbit

Interface Type

Quad-SPI

Package Type

TFBGA

Pin Count

24

Organisation

128M x 8 bit

Mounting Type

Surface Mount

Cell Type

SLC NAND

Minimum Operating Supply Voltage

2.7 V

Maximum Operating Supply Voltage

3.6 V

Dimensions

8.05 x 6.05 x 0.85mm

Number of Words

128M

Minimum Operating Temperature

-40 °C

Number of Bits per Word

8bit

Maximum Operating Temperature

+85 °C

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P.O.A.

Winbond SLC NAND 1Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25N01GVTCIG
Select packaging type

Select packaging type

Standard - each

Available in multiples of 5.

Production -

Available in multiples of 5.

Recommended for ordering in large quantities. Items are packaged ready for insertion into machinery, allowing you to improve production efficiency.

5

Available in multiples of 5
5P.O.A.
10P.O.A.
15P.O.A.
20P.O.A.
25P.O.A.
30P.O.A.
35P.O.A.
40P.O.A.
45P.O.A.
50P.O.A.
55P.O.A.
60P.O.A.
65P.O.A.
70P.O.A.
75P.O.A.

P.O.A.

Winbond SLC NAND 1Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25N01GVTCIG
Stock information temporarily unavailable.
Select packaging type

Select packaging type

Standard - each

Available in multiples of 5.

Production -

Available in multiples of 5.

Recommended for ordering in large quantities. Items are packaged ready for insertion into machinery, allowing you to improve production efficiency.

5

Available in multiples of 5
5P.O.A.
10P.O.A.
15P.O.A.
20P.O.A.
25P.O.A.
30P.O.A.
35P.O.A.
40P.O.A.
45P.O.A.
50P.O.A.
55P.O.A.
60P.O.A.
65P.O.A.
70P.O.A.
75P.O.A.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Brand

Winbond

Memory Size

1Gbit

Interface Type

Quad-SPI

Package Type

TFBGA

Pin Count

24

Organisation

128M x 8 bit

Mounting Type

Surface Mount

Cell Type

SLC NAND

Minimum Operating Supply Voltage

2.7 V

Maximum Operating Supply Voltage

3.6 V

Dimensions

8.05 x 6.05 x 0.85mm

Number of Words

128M

Minimum Operating Temperature

-40 °C

Number of Bits per Word

8bit

Maximum Operating Temperature

+85 °C

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more