Memoria flash, Quad-SPI W25M02GVTCIG 2Gbit, 256M x 8 bit, TFBGA, 24 pines

Código de producto RS: 188-2511Marca: WinbondNúmero de parte de fabricante: W25M02GVTCIG
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Documentos Técnicos

Especificaciones

Brand

Winbond

Tamaño de la Memoria

2Gbit

Tipo de Interfaz

Quad-SPI

Tipo de Encapsulado

TFBGA

Conteo de Pines

24

Organización

256M x 8 bit

Tipo de montaje

Surface Mount

Tipo de Célula

SLC NAND

Tensión de Alimentación de Funcionamiento Mínima

2.7 V

Tensión de Alimentación Máxima de Funcionamiento

3.6 V

Dimensiones del Cuerpo

8.05 x 6.05 x 0.85mm

Número de Bits de Palabra

8bit

Máxima Temperatura de Funcionamiento

+85 °C.

Número de Palabras

256M

Mínima Temperatura de Funcionamiento

–40 °C

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Price on asking

Each (In a Tray of 480) (Sin IVA)

Memoria flash, Quad-SPI W25M02GVTCIG 2Gbit, 256M x 8 bit, TFBGA, 24 pines

480

Disponible en múltiplos de 480
480Price on asking
960Price on asking
1440Price on asking
1920Price on asking
2400Price on asking
2880Price on asking
3360Price on asking
3840Price on asking
4320Price on asking
4800Price on asking
5280Price on asking
5760Price on asking
6240Price on asking
6720Price on asking
7200Price on asking

Price on asking

Each (In a Tray of 480) (Sin IVA)

Memoria flash, Quad-SPI W25M02GVTCIG 2Gbit, 256M x 8 bit, TFBGA, 24 pines

Información de stock no disponible temporalmente.

480

Disponible en múltiplos de 480
480Price on asking
960Price on asking
1440Price on asking
1920Price on asking
2400Price on asking
2880Price on asking
3360Price on asking
3840Price on asking
4320Price on asking
4800Price on asking
5280Price on asking
5760Price on asking
6240Price on asking
6720Price on asking
7200Price on asking

Información de stock no disponible temporalmente.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Documentos Técnicos

Especificaciones

Brand

Winbond

Tamaño de la Memoria

2Gbit

Tipo de Interfaz

Quad-SPI

Tipo de Encapsulado

TFBGA

Conteo de Pines

24

Organización

256M x 8 bit

Tipo de montaje

Surface Mount

Tipo de Célula

SLC NAND

Tensión de Alimentación de Funcionamiento Mínima

2.7 V

Tensión de Alimentación Máxima de Funcionamiento

3.6 V

Dimensiones del Cuerpo

8.05 x 6.05 x 0.85mm

Número de Bits de Palabra

8bit

Máxima Temperatura de Funcionamiento

+85 °C.

Número de Palabras

256M

Mínima Temperatura de Funcionamiento

–40 °C

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more