Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
330µF
Voltage
2.5V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
35mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
82.5 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
€ 31.39
€ 0.314 Each (Supplied on a Reel) (Exc. VAT)
Production pack (Reel)
100
€ 31.39
€ 0.314 Each (Supplied on a Reel) (Exc. VAT)
Stock information temporarily unavailable.
Production pack (Reel)
100
| Quantity | Unit price | Per Reel |
|---|---|---|
| 100 - 240 | € 0.314 | € 3.14 |
| 250 - 490 | € 0.307 | € 3.07 |
| 500 - 990 | € 0.298 | € 2.98 |
| 1000+ | € 0.291 | € 2.91 |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
330µF
Voltage
2.5V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
35mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
82.5 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
