Vishay 33μF Surface Mount Polymer Capacitor, 4V dc

RS Stock No.: 173-0453Brand: VishayManufacturers Part No.: T55B336M004C0200
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Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

33µF

Voltage

4V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3528-21

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

3.5mm

Depth

2.8mm

Maximum Operating Temperature

+105°C

Height

1.9mm

Dimensions

3.5 x 2.8 x 1.9mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

13.2 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets

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€ 631.49

€ 0.316 Each (On a Reel of 2000) (Exc. VAT)

Vishay 33μF Surface Mount Polymer Capacitor, 4V dc

€ 631.49

€ 0.316 Each (On a Reel of 2000) (Exc. VAT)

Vishay 33μF Surface Mount Polymer Capacitor, 4V dc
Stock information temporarily unavailable.

Buy in bulk

QuantityUnit pricePer Reel
2000 - 2000€ 0.316€ 631.49
4000+€ 0.307€ 614.74

Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

33µF

Voltage

4V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3528-21

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

3.5mm

Depth

2.8mm

Maximum Operating Temperature

+105°C

Height

1.9mm

Dimensions

3.5 x 2.8 x 1.9mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

13.2 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets