Technical Document
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
10μF
Voltage
10 V
Mount Type
Surface Mount
Package/Case
3216-18
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
3.2 x 1.6 x 1.6 mm
Length
3.2mm
Height
1.6mm
Depth
1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
€ 3.50
€ 0.35 Each (In a Pack of 10) (Exc. VAT)
10
€ 3.50
€ 0.35 Each (In a Pack of 10) (Exc. VAT)
Stock information temporarily unavailable.
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | € 0.35 | € 3.50 |
| 100 - 240 | € 0.262 | € 2.62 |
| 250 - 490 | € 0.245 | € 2.45 |
| 500 - 990 | € 0.227 | € 2.27 |
| 1000+ | € 0.21 | € 2.10 |
Technical Document
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
10μF
Voltage
10 V
Mount Type
Surface Mount
Package/Case
3216-18
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
3.2 x 1.6 x 1.6 mm
Length
3.2mm
Height
1.6mm
Depth
1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
