Technical Document
Specifications
Brand
TE ConnectivityProduct Type
Backplane Connector
Number of Contacts
60
Current
700mA
Number of Columns
10
Orientation
Straight
Number of Rows
3
Connector Gender
Male
Voltage
250V ac
Housing Material
Polyethylene Terephthalate
Pitch
2.5mm
Contact Material
Phosphor Bronze
Mount Type
Board
Contact Plating
Tin over Nickel
Minimum Operating Temperature
-65°C
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Series
Z-PACK HM-Zd
Country of Origin
China
Product details
TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies
Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.
HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101
Standards
PICMG
Stock information temporarily unavailable.
€ 17.99
€ 17.99 Each (Exc. VAT)
Standard
1
€ 17.99
€ 17.99 Each (Exc. VAT)
Stock information temporarily unavailable.
Standard
1
Technical Document
Specifications
Brand
TE ConnectivityProduct Type
Backplane Connector
Number of Contacts
60
Current
700mA
Number of Columns
10
Orientation
Straight
Number of Rows
3
Connector Gender
Male
Voltage
250V ac
Housing Material
Polyethylene Terephthalate
Pitch
2.5mm
Contact Material
Phosphor Bronze
Mount Type
Board
Contact Plating
Tin over Nickel
Minimum Operating Temperature
-65°C
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Series
Z-PACK HM-Zd
Country of Origin
China
Product details
TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies
Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.
HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101
Standards
PICMG


