TDK 1μF Multilayer Ceramic Capacitor MLCC, 450V dc V, ±20% , SMD

RS Stock No.: 916-3144PBrand: TDKManufacturers Part No.: C5750X7T2W105M250KE
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Technical Document

Specifications

Brand

TDK

Capacitance

1µF

Voltage

450V dc

Package/Case

2220 (5750M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±20%

Dimensions

5.7 x 5 x 2.5mm

Length

5.7mm

Depth

5mm

Height

2.5mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Product details

TDK C Series 2220 (5750) Soft Terminal

Soft Termination C Series MLCC have improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties

• Conductive resin absorb external stress to protect solder joint parts and capacitor body
• Compliance with the RoHS Directive

Applications:

• Switching power supply
• Telecom base station
• Electronic circuits mounted on alumina substrate
• SMT application which requires bending robustness in which solder joint reliability is problematic

Price on asking

Each (Supplied on a Reel) (Exc. VAT)

TDK 1μF Multilayer Ceramic Capacitor MLCC, 450V dc V, ±20% , SMD
Select packaging type

Price on asking

Each (Supplied on a Reel) (Exc. VAT)

TDK 1μF Multilayer Ceramic Capacitor MLCC, 450V dc V, ±20% , SMD

Stock information temporarily unavailable.

Select packaging type

Stock information temporarily unavailable.

Technical Document

Specifications

Brand

TDK

Capacitance

1µF

Voltage

450V dc

Package/Case

2220 (5750M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±20%

Dimensions

5.7 x 5 x 2.5mm

Length

5.7mm

Depth

5mm

Height

2.5mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Product details

TDK C Series 2220 (5750) Soft Terminal

Soft Termination C Series MLCC have improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties

• Conductive resin absorb external stress to protect solder joint parts and capacitor body
• Compliance with the RoHS Directive

Applications:

• Switching power supply
• Telecom base station
• Electronic circuits mounted on alumina substrate
• SMT application which requires bending robustness in which solder joint reliability is problematic