Semikron Heatsink, SEMIPACK, SEMIPONT, SEMITRANS, 0.48K/W, 180 x 125 x 135mm
Technical Document
Specifications
Brand
SemikronFor Use With
SEMIPACK, SEMIPONT, SEMITRANS
Length
180mm
Width
125mm
Height
135mm
Dimensions
180 x 125 x 135mm
Thermal Resistance
0.48K/W
Colour
Black
Product details
P3 Heatsinks for Isolated Power Modules, Semikron
From Semikron, these extruded heatsinks are for use with isolated power modules, and have a polished flat top for mounting to thyristor modules. Constructed from clear or black anodised aluminium they have integrated rails to allow for easy mounting of the modules.
402-383 Black anodised, 135 x 125 x 180 mm
505-2860 Clear anodised, 135 x 125 x 180 mm
505-2876 Clear anodised, 135 x 125 x 300 mm
These Semikron heatsinks may be utilised in the following ways:
• If required, a 120mm axial fan may be mounted at one end to increase the airflow through the heat sink.
• Three aluminium sheets 180mm by 100mm by 2mm (not supplied) should be inserted into the integral slots to provide side and bottom airflow plates.
• Additional devices (i.e. thyristors, transistors, power diodes, etc) may be mounted on these side airflow plates. Slots are provided on the top surface for the mounting bars used to bolt down the thyristor packs. The top surface may also be drilled and tapped to accommodate other devices which need heatsinking.
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P.O.A.
1
Technical Document
Specifications
Brand
SemikronFor Use With
SEMIPACK, SEMIPONT, SEMITRANS
Length
180mm
Width
125mm
Height
135mm
Dimensions
180 x 125 x 135mm
Thermal Resistance
0.48K/W
Colour
Black
Product details
P3 Heatsinks for Isolated Power Modules, Semikron
From Semikron, these extruded heatsinks are for use with isolated power modules, and have a polished flat top for mounting to thyristor modules. Constructed from clear or black anodised aluminium they have integrated rails to allow for easy mounting of the modules.
402-383 Black anodised, 135 x 125 x 180 mm
505-2860 Clear anodised, 135 x 125 x 180 mm
505-2876 Clear anodised, 135 x 125 x 300 mm
These Semikron heatsinks may be utilised in the following ways:
• If required, a 120mm axial fan may be mounted at one end to increase the airflow through the heat sink.
• Three aluminium sheets 180mm by 100mm by 2mm (not supplied) should be inserted into the integral slots to provide side and bottom airflow plates.
• Additional devices (i.e. thyristors, transistors, power diodes, etc) may be mounted on these side airflow plates. Slots are provided on the top surface for the mounting bars used to bolt down the thyristor packs. The top surface may also be drilled and tapped to accommodate other devices which need heatsinking.