Technical Document
Specifications
Brand
onsemiMounting Type
Surface Mount
Package Type
DPAK (TO-252)
Maximum Continuous Forward Current
4A
Peak Reverse Repetitive Voltage
600V
Diode Configuration
Single
Rectifier Type
Fast Recovery
Diode Type
Silicon Junction
Pin Count
3
Maximum Forward Voltage Drop
2.1V
Number of Elements per Chip
1
Diode Technology
Silicon Junction
Peak Reverse Recovery Time
60ns
Peak Non-Repetitive Forward Surge Current
40A
Country of Origin
China
Product details
Rectifier Diodes, 2A to 9A, Fairchild Semiconductor
Diodes and Rectifiers, ON Semiconductor
Whether you are working on a new design, or purchasing, ON Semiconductor provides you with industry-standard diodes and rectifiers, small signal diodes, Schottky and Zener diodes. The components offer the best available combination of quality, features, and packaging options.
Stock information temporarily unavailable.
€ 30.83
€ 1.541 Each (Supplied on a Reel) (Exc. VAT)
Production pack (Reel)
20
€ 30.83
€ 1.541 Each (Supplied on a Reel) (Exc. VAT)
Stock information temporarily unavailable.
Production pack (Reel)
20
| Quantity | Unit price | Per Reel |
|---|---|---|
| 20 - 198 | € 1.541 | € 3.08 |
| 200 - 998 | € 1.336 | € 2.67 |
| 1000+ | € 1.176 | € 2.35 |
Technical Document
Specifications
Brand
onsemiMounting Type
Surface Mount
Package Type
DPAK (TO-252)
Maximum Continuous Forward Current
4A
Peak Reverse Repetitive Voltage
600V
Diode Configuration
Single
Rectifier Type
Fast Recovery
Diode Type
Silicon Junction
Pin Count
3
Maximum Forward Voltage Drop
2.1V
Number of Elements per Chip
1
Diode Technology
Silicon Junction
Peak Reverse Recovery Time
60ns
Peak Non-Repetitive Forward Surge Current
40A
Country of Origin
China
Product details
Rectifier Diodes, 2A to 9A, Fairchild Semiconductor
Diodes and Rectifiers, ON Semiconductor
Whether you are working on a new design, or purchasing, ON Semiconductor provides you with industry-standard diodes and rectifiers, small signal diodes, Schottky and Zener diodes. The components offer the best available combination of quality, features, and packaging options.


