Technical Document
Specifications
Brand
MolexSeries
PMC Mezzanine
Product Type
PCB Header
Pitch
1mm
Current
1A
Number of Contacts
64
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
1mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
85°C
Standards/Approvals
No
Voltage
100 V
Distrelec Product Id
303-58-635
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
Stock information temporarily unavailable.
€ 7.62
€ 7.62 Each (Supplied in a Tube) (Exc. VAT)
Production pack (Tube)
1
€ 7.62
€ 7.62 Each (Supplied in a Tube) (Exc. VAT)
Stock information temporarily unavailable.
Production pack (Tube)
1
Technical Document
Specifications
Brand
MolexSeries
PMC Mezzanine
Product Type
PCB Header
Pitch
1mm
Current
1A
Number of Contacts
64
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
1mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
85°C
Standards/Approvals
No
Voltage
100 V
Distrelec Product Id
303-58-635
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component


