Conector macho para PCB Ángulo de 90° Molex serie MicroClasp de 4 vías, 1 fila, paso 2.0mm, para soldar, Montaje en
Documentos Técnicos
Especificaciones
Brand
MolexSeries
MICROCLASP
Espaciado
2.0mm
Número de Contactos
4
Número de Filas
1
Orientación del Cuerpo
Right Angle
Recubierto/No Recubierto
Shrouded
Connector System
Cable a Placa
Tipo de montaje
Through Hole
Método de Terminación
Soldador
Chapado del Contacto
Tin
Número de serie
55935
Valor Nominal de Corriente
3.0A
Índice de Tensión
250.0 V
País de Origen
Japan
Datos del producto
Conector para placa en ángulo derecho de fila única con refuerzo
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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€ 4,58
€ 0,458 Each (In a Pack of 10) (Sin IVA)
Estándar
10
€ 4,58
€ 0,458 Each (In a Pack of 10) (Sin IVA)
Información de stock no disponible temporalmente.
Estándar
10
Información de stock no disponible temporalmente.
| Cantidad | Precio Unitario sin IVA | Per Pack |
|---|---|---|
| 10 - 190 | € 0,458 | € 4,58 |
| 200 - 740 | € 0,356 | € 3,56 |
| 750 - 2990 | € 0,339 | € 3,39 |
| 3000 - 5990 | € 0,306 | € 3,06 |
| 6000+ | € 0,293 | € 2,93 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificaciones
Brand
MolexSeries
MICROCLASP
Espaciado
2.0mm
Número de Contactos
4
Número de Filas
1
Orientación del Cuerpo
Right Angle
Recubierto/No Recubierto
Shrouded
Connector System
Cable a Placa
Tipo de montaje
Through Hole
Método de Terminación
Soldador
Chapado del Contacto
Tin
Número de serie
55935
Valor Nominal de Corriente
3.0A
Índice de Tensión
250.0 V
País de Origen
Japan
Datos del producto
Conector para placa en ángulo derecho de fila única con refuerzo
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products