Technical Document
Specifications
Material
Bright Zinc Plated
Power Rating
20 → 70W
IP Rating
IP20, IP40
Coil Resistance
11500Ω
Band Width
6.1mm
Height
33.80mm
For Use With
2ASC-12A1HP-SP6LI
Input Range
0 → 2 mA, 0 → 30 V, 0 → 40 mA, 0 → 50mV
Voltage Rating
230V ac
Depth
24mm
Overall Length
29.9mm
Number of Pins
20, 20
Series
UC30
Brand
DetaCountry of Origin
China
Product details
RS Multilayer Chip Baluns, RFBLN Series, 2012 (0805)
RS Pro range offers RFBLN Series, 2012 (0805) Multilayer Chip Baluns with a
miniature footprint: 2.0 x 1.2 x 0.9 mm³.
2 different working band devices Integrated into one package; GSM 850/ GSM 900/ DCS1800/ PCS1900 / TD SCDMA Bands B34 Band Working Frequency
Features and Benefits
Low Insertion Loss
Low in band Amplitude and Phase imbalance enable high performance wireless system operation
Low Temperature Co-fired Ceramic components
Second harmonic suppression
ISM band suppression
Applications:
GSM 850/ GSM 900/ DCS1800/ PCS1900 /TD2025 Band RF and Unbalance to balance conversion
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Technical Document
Specifications
Material
Bright Zinc Plated
Power Rating
20 → 70W
IP Rating
IP20, IP40
Coil Resistance
11500Ω
Band Width
6.1mm
Height
33.80mm
For Use With
2ASC-12A1HP-SP6LI
Input Range
0 → 2 mA, 0 → 30 V, 0 → 40 mA, 0 → 50mV
Voltage Rating
230V ac
Depth
24mm
Overall Length
29.9mm
Number of Pins
20, 20
Series
UC30
Brand
DetaCountry of Origin
China
Product details
RS Multilayer Chip Baluns, RFBLN Series, 2012 (0805)
RS Pro range offers RFBLN Series, 2012 (0805) Multilayer Chip Baluns with a
miniature footprint: 2.0 x 1.2 x 0.9 mm³.
2 different working band devices Integrated into one package; GSM 850/ GSM 900/ DCS1800/ PCS1900 / TD SCDMA Bands B34 Band Working Frequency
Features and Benefits
Low Insertion Loss
Low in band Amplitude and Phase imbalance enable high performance wireless system operation
Low Temperature Co-fired Ceramic components
Second harmonic suppression
ISM band suppression
Applications:
GSM 850/ GSM 900/ DCS1800/ PCS1900 /TD2025 Band RF and Unbalance to balance conversion