CIF 190 x 290mm Reflow Oven With 10 Programs
Technical Document
Specifications
Brand
CIFUseful Reflow Surface
190 x 290mm
Program Memory Size
10
Maximum Operating Temperature
+300°C
Supply Voltage
230V ac
Product details
Forced Convection Reflow Oven FT03
The FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system and its electronics. This reflow oven has been concieved to the reflow of solder paste and polymerization of the glues for prototyping.
Includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.
Features
Compact model, but working area of 190 x 290 mm
Heating through forced convection
Temperature control by microprocessor, max. T° 300°C
View of the card thanks to a large window on the front panel
Easy programming for immediate control
Safety: double window with air circulation, closing door access
PCB Assembly Equipment
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€ 3,197.41
Each (Exc. VAT)
1
€ 3,197.41
Each (Exc. VAT)
1
Technical Document
Specifications
Brand
CIFUseful Reflow Surface
190 x 290mm
Program Memory Size
10
Maximum Operating Temperature
+300°C
Supply Voltage
230V ac
Product details
Forced Convection Reflow Oven FT03
The FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system and its electronics. This reflow oven has been concieved to the reflow of solder paste and polymerization of the glues for prototyping.
Includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.
Features
Compact model, but working area of 190 x 290 mm
Heating through forced convection
Temperature control by microprocessor, max. T° 300°C
View of the card thanks to a large window on the front panel
Easy programming for immediate control
Safety: double window with air circulation, closing door access
PCB Assembly Equipment