Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
$ 4.76
$ 4.76 Each (Exc. VAT)
1
$ 4.76
$ 4.76 Each (Exc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price |
|---|---|
| 1 - 9 | $ 4.76 |
| 10 - 19 | $ 4.55 |
| 20 - 49 | $ 4.40 |
| 50+ | $ 4.05 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
