Resistencia de montaje en panel TE Connectivity, 150Ω ±5% 25W, Con carcasa de aluminio, Orejeta de Soldadura, Bobinado
Documentos Técnicos
Especificaciones
Brand
TE ConnectivityRango
150Ω
Clasificación de Potencia
25W
Series
HSA25
Encapsulado
Carcasa de aluminio
Tolerancia
5%
Technology
Bobinado
Estilo de Terminación
Solder Lug
Mínimo Coeficiente de Temperatura
-30ppm/°C
Máximo Coeficiente de Temperatura
+30ppm/°C
País de Origen
India
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Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificaciones
Brand
TE ConnectivityRango
150Ω
Clasificación de Potencia
25W
Series
HSA25
Encapsulado
Carcasa de aluminio
Tolerancia
5%
Technology
Bobinado
Estilo de Terminación
Solder Lug
Mínimo Coeficiente de Temperatura
-30ppm/°C
Máximo Coeficiente de Temperatura
+30ppm/°C
País de Origen
India
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products