Transistor digital, FDMC86262P, MLP 3.3 x 3.3, 8 pines
Documentos Técnicos
Especificaciones
Brand
onsemiTipo de Encapsulado
MLP 3.3 x 3.3
Tipo de montaje
Surface Mount
Disipación de Potencia Máxima
40 W
Conteo de Pines
8
Número de Elementos por Chip
1
Temperatura máxima de funcionamiento
+150 ºC
Dimensiones del Cuerpo
3.3 x 3.3 x 0.72mm
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€ 0,475
Each (On a Reel of 3000) (Sin IVA)
3000
€ 0,475
Each (On a Reel of 3000) (Sin IVA)
3000
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificaciones
Brand
onsemiTipo de Encapsulado
MLP 3.3 x 3.3
Tipo de montaje
Surface Mount
Disipación de Potencia Máxima
40 W
Conteo de Pines
8
Número de Elementos por Chip
1
Temperatura máxima de funcionamiento
+150 ºC
Dimensiones del Cuerpo
3.3 x 3.3 x 0.72mm
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products