Par Darlington, MC33025PG, PDIP, 16 pines
Documentos Técnicos
Especificaciones
Brand
ON SemiconductorTipo de Encapsulado
DIP
Tipo de montaje
Through Hole
Conteo de Pines
16
Temperatura Mínima de Operación
-40 ºC
Altura
3.43mm
Dimensiones del Cuerpo
19.55 x 6.85 x 3.43mm
Máxima Temperatura de Funcionamiento
105 °C
Longitud
19.55mm
Ancho
6.85mm
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Información de stock no disponible temporalmente.
Vuelva a verificar más tarde.
P.O.A.
1
P.O.A.
1
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificaciones
Brand
ON SemiconductorTipo de Encapsulado
DIP
Tipo de montaje
Through Hole
Conteo de Pines
16
Temperatura Mínima de Operación
-40 ºC
Altura
3.43mm
Dimensiones del Cuerpo
19.55 x 6.85 x 3.43mm
Máxima Temperatura de Funcionamiento
105 °C
Longitud
19.55mm
Ancho
6.85mm
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products