Condensador cerámico multicapa MLCC, KYOCERA AVX, 82pF, ±5%, 200V dc, Montaje en Superficie, C0G dieléctrico
Documentos Técnicos
Especificaciones
Brand
KYOCERA AVXCapacitancia
82pF
Voltage
200V dc
Paquete/Carcasa
0805 (2012M)
Tipo de montaje
Surface Mount
Dieléctrico
C0G
Tolerancia
5%
Dimensiones
2.01 x 1.25 x 1.02mm
Longitud:
2.01mm
Profundidad
1.25mm
Altura
1.02mm
Serie
U
Temperatura de Funcionamiento Máxima
+125°C
Mínima Temperatura de Funcionamiento
-55°C
Tipo terminal
Surface Mount
Datos del producto
Serie 0805 con ESR ultrabaja de AVX
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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€ 0,089
Each (On a Reel of 2000) (Sin IVA)
2000
€ 0,089
Each (On a Reel of 2000) (Sin IVA)
2000
Documentos Técnicos
Especificaciones
Brand
KYOCERA AVXCapacitancia
82pF
Voltage
200V dc
Paquete/Carcasa
0805 (2012M)
Tipo de montaje
Surface Mount
Dieléctrico
C0G
Tolerancia
5%
Dimensiones
2.01 x 1.25 x 1.02mm
Longitud:
2.01mm
Profundidad
1.25mm
Altura
1.02mm
Serie
U
Temperatura de Funcionamiento Máxima
+125°C
Mínima Temperatura de Funcionamiento
-55°C
Tipo terminal
Surface Mount
Datos del producto
Serie 0805 con ESR ultrabaja de AVX
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.