Conector D-sub Amphenol ICC, paso 2.29mm, Recto D-Sub de alta densidad, Montaje en Panel Mount, Macho, Terminación
Documentos Técnicos
Especificaciones
Brand
Amphenol ICCNúmero de Contactos
15
Género
Male
Orientación del Cuerpo
Straight
Tipo de Montaje
Panel Mount
Espaciado
2.29mm
Tipo de conector D
D-Sub de alta densidad
Método de Terminación
Soldador
Tamaño de carcasa D-Sub
E
Valor Nominal de Corriente
2.5A
Material de la Carcasa
Steel
Índice de Tensión
250.0 V
Longitud
30.81mm
Profundidad
4.8mm
Profundidad
12.55mm
Dimensiones
30.81 x 4.8 x 12.55mm
Chapado de los contactos
Gold over Nickel
Material del Contacto
Copper Alloy
Temperatura de Funcionamiento Mínima
-55.0°C
Máxima Temperatura de Funcionamiento
105.0°C
País de Origen
China
Datos del producto
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
Estos conectores D-Sub HD son de montaje en panel con orificios estándar de Ø3,1 mm y tienen terminación de cable de cilindro de soldadura.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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€ 0,846
Each (In a Tray of 90) (Sin IVA)
90
€ 0,846
Each (In a Tray of 90) (Sin IVA)
90
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificaciones
Brand
Amphenol ICCNúmero de Contactos
15
Género
Male
Orientación del Cuerpo
Straight
Tipo de Montaje
Panel Mount
Espaciado
2.29mm
Tipo de conector D
D-Sub de alta densidad
Método de Terminación
Soldador
Tamaño de carcasa D-Sub
E
Valor Nominal de Corriente
2.5A
Material de la Carcasa
Steel
Índice de Tensión
250.0 V
Longitud
30.81mm
Profundidad
4.8mm
Profundidad
12.55mm
Dimensiones
30.81 x 4.8 x 12.55mm
Chapado de los contactos
Gold over Nickel
Material del Contacto
Copper Alloy
Temperatura de Funcionamiento Mínima
-55.0°C
Máxima Temperatura de Funcionamiento
105.0°C
País de Origen
China
Datos del producto
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
Estos conectores D-Sub HD son de montaje en panel con orificios estándar de Ø3,1 mm y tienen terminación de cable de cilindro de soldadura.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products