Documentos Técnicos
Especificaciones
Brand
MolexSeries
MICROCLASP
Espaciado
2.0mm
Número de Contactos
18
Número de Filas
2
Orientación del Cuerpo
Straight
Recubierto/No Recubierto
Shrouded
Connector System
Wire to Board
Tipo de montaje
Surface Mount
Método de Terminación
Soldador
Chapado de los contactos
Tin
Material del Contacto
Brass
Número de serie
55917
Valor Nominal de Corriente
3.0A
Índice de Tensión
250.0 V
Datos del producto
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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P.O.A.
Estándar
10
P.O.A.
Estándar
10
Documentos Técnicos
Especificaciones
Brand
MolexSeries
MICROCLASP
Espaciado
2.0mm
Número de Contactos
18
Número de Filas
2
Orientación del Cuerpo
Straight
Recubierto/No Recubierto
Shrouded
Connector System
Wire to Board
Tipo de montaje
Surface Mount
Método de Terminación
Soldador
Chapado de los contactos
Tin
Material del Contacto
Brass
Número de serie
55917
Valor Nominal de Corriente
3.0A
Índice de Tensión
250.0 V
Datos del producto
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.