Bergquist Non-Silicone Thermal Grease, 1.5W/m·K
Technical Document
Specifications
Brand
BergquistThermal Conductivity
1.5W/m·K
Material
Non-Silicone
Maximum Operating Temperature
+150°C
Pack Size
0.5 ml
Operating Temperature Range
Maximum of +150 °C
Country of Origin
United States
Product details
TIC™ 1000A Compound
Thermally compound intended for use as thermal interface between processors and heatsink.
High thermal performance : 0.32°C/W ( TO220 termal test @ 50 psi)
Density (g/cc) : 2.1
The compound requires pressure of assembly to cause flow
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Technical Document
Specifications
Brand
BergquistThermal Conductivity
1.5W/m·K
Material
Non-Silicone
Maximum Operating Temperature
+150°C
Pack Size
0.5 ml
Operating Temperature Range
Maximum of +150 °C
Country of Origin
United States
Product details
TIC™ 1000A Compound
Thermally compound intended for use as thermal interface between processors and heatsink.
High thermal performance : 0.32°C/W ( TO220 termal test @ 50 psi)
Density (g/cc) : 2.1
The compound requires pressure of assembly to cause flow